IC decap test

Short Description:

GRGT’s IC Chip Decapsulation Testing involves cross-sectional analysis to inspect:
Bonding wires and gold balls: Integrity and alignment.
Surface aluminum traces: Damage or deformation.
Chip cracks: Structural defects.
Photolithography defects: Mask alignment or pattern irregularities.

Wafer-level testing (WLT) verification: Confirmation of mid-process testing completion.
Chip name consistency: Match between the actual chip identifier and the circuit design layout.

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Product Detail

Product Tags

Service scope

Chip Decapsulation Testing is a critical step in chip manufacturing and packaging processes, significantly impacting device reliability, quality, and production costs. Conducting decapsulation testing is essential in chip applications to ensure performance and defect mitigation. GRGT Measurement offers multiple decapsulation methods, including:

Chemical Decapsulation
Laser Decapsulation
Mechanical Decapsulation

Integrated Analysis:
Combined with Optical Microscopy (OM) and X-ray Imaging, these techniques pinpoint anomalies and identify potential failure causes, such as:

Structural defects (e.g., cracks, delamination).
Bonding wire misalignment or damage.
Mask misalignment or lithography flaws.

Purpose: Validate design integrity, optimize processes, and reduce production risks.

Test Standards

MIL-STD-883-2-2022 Mechanical test methods for microcircuits Part 2

AEC-Q102- Rev A April 6, 2020 Verification of automotive optoelectronic semiconductors based on failure mechanism in stress testing

GJB 548C-2021 Test methods and procedures for microelectronic devices

GJB 4027B-2021 Methods of destructive physical analysis of military electronic components

Service Items

Chip decapsulation testing refers to the process of measuring and analyzing a chip’s internal electrical performance, reliability, and physical parameters after its packaging is removed, thereby assessing its quality. It specifically includes the following aspects:

Electrical Parameter Testing
Electrical parameter testing is the fundamental and key component of chip decapsulation testing. The main test items include static characteristics, dynamic characteristics, power consumption, and temperature. Static characteristics cover tests of resistance, capacitance, and inductance, while dynamic characteristics cover tests of voltage, current, and frequency.
Physical Performance Testing
Physical performance testing is an indispensable part of the chip decapsulation testing process. It primarily involves hardness testing, bonding strength testing, and stress testing. These tests directly reflect the quality of the chip packaging and are essential for ensuring proper chip operation.
IC Reliability Testing
IC reliability testing is a critical stage in the process, serving as an indicator of the quality of chip packaging. The main test items include IC bonding reliability, external connection reliability, and temperature cycling, which collectively ensure a more stable guarantee for chip usage.
Form and Dimension Testing
Form and dimension testing refers to the evaluation of chip volume, dimensions, flatness, and straightness, all of which can directly affect the stability and reliability of the IC during operation.