Silicon Optical Chip Testing
Service Introduction
With the continuous development of large-scale integrated circuits, the chip manufacturing process is becoming more and more complex, and the abnormal microstructure and composition of semiconductor materials hinder the improvement of chip yield, which brings great challenges to the implementation of new semiconductor and integrated circuit technologies.
GRGTEST provides comprehensive semiconductor material microstructure analysis and evaluation to help customers improve semiconductor and integrated circuit processes，including preparation of wafer level profile and electronic analysis, comprehensive analysis of physical and chemical properties of semiconductor manufacturing related materials, formulation and implementation of semiconductor material contaminant analysis program.
Service scope
Functional Units: Silicon photonic chip, MPD, heater, MZI, optical waveguide, laser, etc.
Material Systems: Si, SiN, LiNbO₃.
Test Items
Parameter Testing Projects: Coupling loss, modulation efficiency, transmission loss, bandwidth, resistance, dark current, responsivity, eye diagram, mode profile, etc. These projects support batch screening and customized standardized testing solutions.
Aging and Reliability Validation: Tests for silicon photonic chips such as HTOL, HTRB, THB, etc., with support for MPD, heater, MZI, optical waveguide, laser, among others.
Service Background
With the rapid development of fields such as 5G, cloud computing, and big data, the demand for high-speed, low-power, and highly integrated optical communication chips has surged. Silicon photonic chips have become the industry's focus due to their advantages, including compatibility with CMOS processes, low cost, and compact size. However, their complex manufacturing processes can easily lead to deviations in optical performance and abnormalities in electrical parameters. To ensure their performance and quality—and to meet the needs of critical applications in communications and data centers—testing and screening of silicon photonic chips are indispensable.
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